Experiences:
Gersteltec Sarl, Suisse, Functional SU8 photoepoxy integration. MEMS, MOMES, LIGA Microparts.
ICP- Israel- IBM Packaging Assembly, integration
IMEC- Belgium, Front and Back End Processing Photoepoxy Process Integration in multilevel interconnect.
Ecole Polytechnique Federal de Lausanne Thin films coating
Specialties: Developing and Integration of Low -cost Photoepoxy material for microelectronic, nanotechnology and microparts systems.
MEMS, MOMES, LIGA, MST, BioMEMS, NanoMEMS
Experiences:
Gersteltec Sarl, Suisse, Functional SU8 photoepoxy integration. MEMS, MOMES, LIGA Microparts.
ICP- Israel- IBM Packaging Assembly, integration
IMEC- Belgium, Front and Back End Processing Photoepoxy Process Integration in multilevel interconnect.
Ecole Polytechnique Federal de Lausanne Thin films coating
Specialties: Developing and Integration of Low -cost Photoepoxy material for microelectronic, nanotechnology and microparts systems.
MEMS, MOMES, LIGA, MST, BioMEMS, NanoMEMS
Modal header
We've updated our privacy policy.
We鈥檝e updated our privacy policy so that we are compliant with changing global privacy regulations and to provide you with insight into the limited ways in which we use your data.
You can read the details below. By accepting, you agree to the updated privacy policy.
