Experiences:
Gersteltec Sarl, Suisse, Functional SU8 photoepoxy integration. MEMS, MOMES, LIGA Microparts.
ICP- Israel- IBM Packaging Assembly, integration
IMEC- Belgium, Front and Back End Processing Photoepoxy Process Integration in multilevel interconnect.
Ecole Polytechnique Federal de Lausanne Thin films coating
Specialties: Developing and Integration of Low -cost Photoepoxy material for microelectronic, nanotechnology and microparts systems.
MEMS, MOMES, LIGA, MST, BioMEMS, NanoMEMS
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