Hunlan Lin is a student at the University of Washington expected to graduate in June 2013 with degrees in Electrical Engineering and Computer Engineering and a GPA of 3.89. He has experience with both hardware and software skills including C, Java, Android, microprocessors, and CAD tools. For projects, he has worked on a tracheotomy surgical simulation mobile app, a genome alignment hardware system, and designed a wireless drum set. He also had an internship at Indeed where he built resume importing and indexing features.