AMD Ryzen and Althon 7020 Series Product BriefLow Hong Chuan
?
This document contains confidential AMD internal information regarding upcoming product launches and design wins. It discusses the "Mendocino" product launching in 2023 and projected design wins across several market segments including premium thin and light, elite ultrathin, extreme gaming and creator, and mainstream thin and light devices. The document contains multiple confidentiality notices and references to several internal endnotes.
The document is a briefing from AMD on their upcoming launch of new EPYC 7Fx2 processors. It provides details on the processors' expected performance leadership in various workloads compared to Intel Xeon alternatives, including highest performance on SPECrate benchmarks. It highlights new features like higher frequencies and support from partners like Nutanix. It concludes by detailing the new top-of-stack 7002 series processors with up to 24 cores and competitive performance and pricing compared to Intel.
AMD CES 2020 Press Conference PresentationLow Hong Chuan
?
The document appears to be an internal AMD document marked for AMD official use only and internal distribution only. It does not contain any other substantive information.
The document discusses an embargoed presentation by Intel on January 5th. It provides information on the event details, including instructions to refrain from sharing information until after the embargo is lifted at 10 pm PT. It also invites attendees to a drinks reception afterwards. The presentation will focus on innovations across Intel's technology pillars to enable the next era of computing, with a focus on AI, notebooks, and 10th generation Intel Core processors.
This document is a launch deck for the Radeon Software Adrenalin 2020 Edition. It provides information on new features for home, gaming, streaming and performance improvements. Key highlights include up to 34% faster driver installation, up to 23% average performance increase with Radeon Boost, and an average of 12% higher performance versus the previous year's driver based on internal testing. The deck is marked as confidential until 9:00AM ET on December 10th, 2019.
This document discusses a new class of embedded processing that is under embargo until April 16, 2019 at 3:30 AM ET. It references a 2017 document about mapping the future of silicon for AI. The new embedded processing provides improved performance compared to previous generations while maintaining a focus on low power. It also allows for a range of applications from edge servers to client devices.
AMD is announcing mobility updates at CES 2019, including new Ryzen processors and Radeon graphics for laptops. The document provides details on AMD's latest mobile CPUs and APUs with up to 4 cores and 8-threads, and Radeon Vega and Radeon RX graphics. Performance benchmarks show AMD processors outperforming Intel chips in various tasks like web browsing, productivity applications, and gaming. AMD aims to provide longer battery life and better performance over older devices to drive growth in the mobile market.
The document summarizes new Intel Core X-series desktop processors, including:
- Up to 18 cores, 36 threads, and 68 PCIe lanes for powerful multithreaded workloads.
- Features like Solder Thermal Interface Material and Intel Turbo Boost Max Technology 3.0 for optimized performance.
- Designed for creators to simultaneously record, edit, render and more with the flexibility to customize their system.
- Provides up to 73% faster 3D rendering and 50% faster video editing than Intel Core S-series processors.
Mark Papermaster Next Horizon PresentationLow Hong Chuan
?
The document provides details on AMD's next-generation EPYC server processor architecture codenamed "Rome" including:
- It will use a multi-chip module design with up to 8 seven nanometer CPU chiplets arranged around an I/O chip.
- Each CPU chiplet contains enhanced cores based on the new "Zen 2" microarchitecture with improvements to branch prediction, prefetching, caches, and floating point throughput.
- The MCM package will connect the CPU chiplets through an Infinity Fabric interconnect to provide a large amount of cores, threads, cache, and I/O in a single processor.
AMD's internal testing showed that its new "Zen 2" CPUs can complete more instructions per cycle than the previous "Zen 1" generation across floating point and integer benchmarks, indicating improved performance. The estimated increase in instructions per cycle is based on AMD's own microbenchmark tests comparing "Zen 2" to "Zen 1".
AMD's internal testing showed that its new "Zen 2" CPUs can perform around 15% more instructions per cycle than previous "Zen 1" generation CPUs, based on a combination of floating point and integer benchmarks. The increase in instructions per cycle was estimated from AMD's microbenchmark tests that compared "Zen 2" to "Zen 1" performance.
The document discusses the Snapdragon 845 mobile platform and benchmarks used to evaluate its performance. It notes that Snapdragon 845 powers over 120 device designs and provides improved performance over Snapdragon 835 through its Kryo 385 CPU, Adreno 630 GPU, and other components. However, it states that popular benchmarks only evaluate a limited subset of Snapdragon 845's capabilities and advocates evaluating real user experiences through tests of graphics, audio, AI, security and other functions instead.
Intel 8th Core G Series with Radeon Vega M Low Hong Chuan
?
The document discusses 8th generation Intel Core processors with Radeon RX Vega M graphics. It provides an overview of the new processors and their positioning for gaming, content creation, and VR/MR. It highlights key features like Intel EMIB technology, HBM2 memory, and dynamic power sharing. Performance benchmarks show improvements over 3-year-old systems for gaming, productivity and content creation workloads. Innovative thin and light desktop designs are also discussed.
AMD Ryzen Mobile with Radeon Vega Graphics Low Hong Chuan
?
This document contains technical details about AMD's Ryzen Mobile processors, including performance benchmarks and power optimization techniques. Key points include: Ryzen Mobile processors offer improved battery life over previous generations, with VP9 video playback extended up to 9.2 hours; the processors use "Zen" CPU cores and "Vega" graphics cores on a single chip with an Infinity Fabric interconnect; and AMD has implemented various power optimization techniques like deeper low power states and fine-grained power gating to reduce power consumption.
7. 行動行銷時代,已經來臨
LINE 擁有高活躍度的使用者族群
月活躍用戶 MAU 80% ; 日活躍用戶 DAU 60%
*MAU = Monthly Active Users (Users who have used the app more than once per month)
DAU = Daily Active Users (Users who have used the app more than once per day)
60%的人會用智慧型手機找尋產品資訊 — 行動商務時代來臨
86%的用戶透過智慧型手機與他人「溝通」— 行動溝通時代來臨,LINE!
資料來源:“Our Mobile Planet: 台灣”, Google, May, 2013
9. LINE 台灣強勁表現
Source: Online Research by INSIGHTXPLORER, INC. (Feb 2014/May 2014)
智慧型手機 通訊軟體到達率
心佔率
LINE
79.2%
Skype
6.6%
Facebook
2.6%
其他
11.6%
有接近80%的使用者提到通訊軟體時第一個會想到LINE。
且LINE在智慧型手機上的普及率為92%,遠超過其他通訊軟體。