The document discusses several key challenges in physical design for semiconductor chips. It outlines general challenges faced in analog, digital, and mixed-signal design such as manufacturing technology limitations, leakage power, interconnect delay, and congestion. Specific issues discussed in more detail include routing congestion, IR drop causing voltage variations, crosstalk interference, scaling challenges between different process nodes, and thermal issues in 3D chip design involving through-silicon vias. The document provides an overview of design objectives to optimize power, timing, area, and yield against these physical implementation challenges.
The document compares the processes for making 2D and 3D chips. For 2D chips, patterns of UV light are focused on a silicon wafer coated with photoresist, exposed areas are etched away, and ions are showered on to dope silicon and make transistors. The process is repeated 4+ times to add metal interconnects and insulators. For 3D chips, the same equipment and materials are used, but additional steps stack polysilicon transistors vertically by repeating photolithography and etching to create active polysilicon regions and adding new layers like polysilicon, tungsten, and antifuse material. The 3D process is repeated 9 times to stack 8 memory cells.
Engineering Your Supply Chain for Exponential GrowthIntrigo Systems
?
Larry Sladewski, Senior Director of Materials at NVIDIA and Intrigo, will give you an update on NVIDIA's supply chain initiative. This presentation will focus on critical operations and the need to dynamically reallocate build plans, WIP, and inventory across the supply chain. [Presented at the 2012 SAP Summit on Suppy Chain Management in Palo Alto, CA]
【Intern Case Study_矽智財】
矽智財 (IP) 是 IC 設計所使用的智慧財產權,是一組事前設計好並驗證完畢、可重複使用的功能組塊,屬於半導體產業的上游,隨著 IC 產業垂直分工化的趨勢而崛起,具有高進入門檻、無庫存、高毛利等特色。
矽智財產業的商業模式為將設計好的 IP 模組授權給買家使用,初次會收取授權金 (License),往後開始量產則轉為收取權利金 (Royalty)。隨著先進製程不斷演進,全球矽智財市場也高速成長,終端市場以消費性電子為大宗,車用與 AI 應用則為主要成長動能。
Flip chip is an advanced packaging technique where bare semiconductor chips are flipped upside down and bonded directly to a printed circuit board using solder bumps. It was introduced by IBM in 1962 as Solid Logic Technology and later converted to Controlled Collapse Chip Connection. Flip chip packaging provides shorter interconnect lengths, lower inductance and higher density interconnects compared to wire bonding. It allows for area array interconnect layouts and has become the standard for high performance integrated circuits. Reliability can be improved through underfilling, which compensates for thermal expansion differences and protects the solder joints.
Form 3 Science Chapter 6 Minerals in earth crustSook Yen Wong
?
Minerals are naturally occurring inorganic solids with a definite chemical composition and structure. They can exist as elements like gold or silver or as compounds like oxides, carbonates, and silicates. Common minerals include iron oxide, calcium carbonate, aluminum silicate, and iron and lead sulfides. When heated, carbonates break down into oxides and carbon dioxide gas, while sulfides break down into oxides and sulfur dioxide gas.
PLNOG 9: Robert D?browski - Carrier-grade NAT (CGN) Solution with FortiGatePROIDEA
?
Fortinet provides a carrier-grade NAT (CGN) solution using FortiGate firewalls. FortiGate firewalls offer high performance and scalability for CGN deployments through dedicated hardware. They can support millions of concurrent sessions and terabits of throughput. FortiGate firewalls also provide detailed logging, security features like ALGs, and redundancy for carrier networks.
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
?
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
?Small-form-factor
?Lightweight technology
?Low-profile technology
?High-pin-count technology
?High-speed technology
?High Reliability
?Improved thermal management
?Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
? Reduced form factor
? Low cost
?Demand is reaching available capacity
?Technology innovation in fan-in WLP continues:
? Die size increases
? Bump pitch reduces
?Foundry involvement is no longer a dent in fan-in WLP production
?Increased activity of Chinese capital on the market
?New applications are emerging while other are declining
? Disruptions also expected in the MEMS and CIS domains
? Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
LTE, LTE A, and LTE A Pro Migration to 5G Training : Tonex TrainingBryan Len
?
LTE, LTE-A, and LTE-A Pro Migration to 5G Training covers LTE, LTE-Advanced, LTE-Advanced Pro,?features and enhancements and migration towards 5G.? Other topics include: 5G NR, Air Interface Architecture, 5G Core (5GC) Architecture, Nodes, Interfaces, and Operation.
Topics Include:?
5GC Overview
5G Technology Overview
5G System Survey
5G Architecture and Interfaces
5G Network Services
5G-NR Architecture, Interfaces, Protocols and Operations
5G-NR Signaling
5G Core (5GC) Architecture, Interfaces, Protocols and Operations
Multi-Access Edge Computing (MEC)
Advanced LPWA for IoT
5G Signaling and Operations
5G Protocol and Architecture
5GC Network Solutions
5G Network Design and Optimization
5G Network Roll-Out
5G Capacity Planning
5G For Non-Engineers and Managers
5G RAN Signaling
5G RF Engineering
5G RF Planning
Learning Objectives:
After completing this course, the student will be able to:
Describe the evolution from LTE/LTE-A and LTE-A Pro to 5G
Summarize LTE-A pro architecture enhancements towards 5G
Describe the fundamentals of 5G networks
Illustrate the architecture of the 5G network including 5G NR,5GC
Describe Enhanced Mobile Broadband (eMBB), Massive Machine Type (mMTC) Communications and Ultra-Reliable and Low Latency Communications (URLLC) features in 5G
Identify key 5G network functions, interfaces, protocols and interworking elements
Describe how the 5G NR works
Describe 5GC network functions and interfaces
Compare 5G Service Based Architecture vs. Reference Point Architecture
Describe ingratiation paths to 5G
Courses Material, Tools and Guides, Outlines:
Evolution from LTE/LTE-A Pro to 5G
Overview of 5G Network Services
5G Radio and Core Network Architecture
Network Slicing in 5G
Architecture Evolution from LTE/LTE-A and LTE-A Pro to 5G NR
Cloud and Open RAN Architectures
Control and User Plane Architecture and Bearer Types
Introduction 5G Core Network (5GC)
Overview of 5G Core Network (5GC) Network Entities
?5G Network Deployment and Migration Paths
Case Studies
Request more information about LTE, LTE-A, and LTE-A Pro Migration to 5G Training. Visit Tonex.com link below
https://www.tonex.com/training-courses/lte-lte-a-and-lte-a-pro-migration-to-5g-training/
The document discusses Surface Mount Technology (SMT) used in electronic circuit board production. SMT involves mounting electronic components directly onto the surface of printed circuit boards rather than inserting them into holes. The key steps of SMT include receiving printed circuit boards, applying glue, placing chips and integrated circuits using specialized machines, curing the boards in a reflow oven, conducting visual and automated inspections, and any needed repairs. The document outlines the advantages of SMT, such as higher component density, improved mechanical and electrical performance, and faster automated assembly.
1) The 1st generation (1G) of mobile networks in the 1980s used analog signals and had disadvantages like poor voice quality and limited capacity.
2) The 2nd generation (2G) digital networks beginning in 1991 had benefits like encrypted calls and new data services like texting. Technologies included GSM, CDMA, and TDMA.
3) Improvements like 2.5G's GPRS and 2.75G's EDGE enabled faster data rates and limited web browsing between 2G and 3G.
PLNOG 9: Robert D?browski - Carrier-grade NAT (CGN) Solution with FortiGatePROIDEA
?
Fortinet provides a carrier-grade NAT (CGN) solution using FortiGate firewalls. FortiGate firewalls offer high performance and scalability for CGN deployments through dedicated hardware. They can support millions of concurrent sessions and terabits of throughput. FortiGate firewalls also provide detailed logging, security features like ALGs, and redundancy for carrier networks.
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
?
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
?Small-form-factor
?Lightweight technology
?Low-profile technology
?High-pin-count technology
?High-speed technology
?High Reliability
?Improved thermal management
?Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
? Reduced form factor
? Low cost
?Demand is reaching available capacity
?Technology innovation in fan-in WLP continues:
? Die size increases
? Bump pitch reduces
?Foundry involvement is no longer a dent in fan-in WLP production
?Increased activity of Chinese capital on the market
?New applications are emerging while other are declining
? Disruptions also expected in the MEMS and CIS domains
? Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
LTE, LTE A, and LTE A Pro Migration to 5G Training : Tonex TrainingBryan Len
?
LTE, LTE-A, and LTE-A Pro Migration to 5G Training covers LTE, LTE-Advanced, LTE-Advanced Pro,?features and enhancements and migration towards 5G.? Other topics include: 5G NR, Air Interface Architecture, 5G Core (5GC) Architecture, Nodes, Interfaces, and Operation.
Topics Include:?
5GC Overview
5G Technology Overview
5G System Survey
5G Architecture and Interfaces
5G Network Services
5G-NR Architecture, Interfaces, Protocols and Operations
5G-NR Signaling
5G Core (5GC) Architecture, Interfaces, Protocols and Operations
Multi-Access Edge Computing (MEC)
Advanced LPWA for IoT
5G Signaling and Operations
5G Protocol and Architecture
5GC Network Solutions
5G Network Design and Optimization
5G Network Roll-Out
5G Capacity Planning
5G For Non-Engineers and Managers
5G RAN Signaling
5G RF Engineering
5G RF Planning
Learning Objectives:
After completing this course, the student will be able to:
Describe the evolution from LTE/LTE-A and LTE-A Pro to 5G
Summarize LTE-A pro architecture enhancements towards 5G
Describe the fundamentals of 5G networks
Illustrate the architecture of the 5G network including 5G NR,5GC
Describe Enhanced Mobile Broadband (eMBB), Massive Machine Type (mMTC) Communications and Ultra-Reliable and Low Latency Communications (URLLC) features in 5G
Identify key 5G network functions, interfaces, protocols and interworking elements
Describe how the 5G NR works
Describe 5GC network functions and interfaces
Compare 5G Service Based Architecture vs. Reference Point Architecture
Describe ingratiation paths to 5G
Courses Material, Tools and Guides, Outlines:
Evolution from LTE/LTE-A Pro to 5G
Overview of 5G Network Services
5G Radio and Core Network Architecture
Network Slicing in 5G
Architecture Evolution from LTE/LTE-A and LTE-A Pro to 5G NR
Cloud and Open RAN Architectures
Control and User Plane Architecture and Bearer Types
Introduction 5G Core Network (5GC)
Overview of 5G Core Network (5GC) Network Entities
?5G Network Deployment and Migration Paths
Case Studies
Request more information about LTE, LTE-A, and LTE-A Pro Migration to 5G Training. Visit Tonex.com link below
https://www.tonex.com/training-courses/lte-lte-a-and-lte-a-pro-migration-to-5g-training/
The document discusses Surface Mount Technology (SMT) used in electronic circuit board production. SMT involves mounting electronic components directly onto the surface of printed circuit boards rather than inserting them into holes. The key steps of SMT include receiving printed circuit boards, applying glue, placing chips and integrated circuits using specialized machines, curing the boards in a reflow oven, conducting visual and automated inspections, and any needed repairs. The document outlines the advantages of SMT, such as higher component density, improved mechanical and electrical performance, and faster automated assembly.
1) The 1st generation (1G) of mobile networks in the 1980s used analog signals and had disadvantages like poor voice quality and limited capacity.
2) The 2nd generation (2G) digital networks beginning in 1991 had benefits like encrypted calls and new data services like texting. Technologies included GSM, CDMA, and TDMA.
3) Improvements like 2.5G's GPRS and 2.75G's EDGE enabled faster data rates and limited web browsing between 2G and 3G.
Este documento proporciona enlaces a varios textos clásicos de filosofía política y ética, incluyendo La República de Platón, Meditaciones Metafísicas de Descartes, Segundo Tratado sobre el Gobierno Civil de Locke, el Tratado sobre la Naturaleza Humana de Hume, Utilitarismo de Mill, Fundamentación de la Metafísica de las Costumbres de Kant, y selecciones de textos de Nietzsche. Los enlaces llevan a resúmenes y extractos en catalán de estas obras fundament
2. QU? ?S?
? ?s un trastorn pertanyent al grup dels desordres
d’ansietat.
? Afecta al 2% de la població, és a dir, a més de 100
milions de persones en el món.
? El descobriment que alguns fàrmacs són efica?os en el
tractament del TOC. ha canviat el punt de vista que es
tenia d'aquesta malaltia.
? Avui no només existeixen teràpies eficaces sinó que
també hi ha una gran activitat investigadora sobre les
causes que produeixen aquesta malaltia i una recerca de
nous tractaments.
3. Obsessions Compulsions
Idees, pensaments o imatges que envaeixen Conductes repetitives i aparentment finalistes.
la consciència.
Viscuts com repugnants o sense sentit. Es realitzen segons determinades regles de
forma estereotipada.
El malalt realitza intents per a ignorar-los o La conducta està dissenyada per a produir o
suprimir-los, de vegades sense aconseguir- evitar algun esdeveniment o situació futura.
ho.
Sensació de compulsió subjectiva juntament
amb un desig de resistir-la.
L'individu reconeix la falta de sentit de la
conducta i no obté plaer en portar a terme
aquesta activitat.
El pensament apareix dominat per una idea
intrusiva o seqüència d'idees, que busquen
apagar amb comportaments rituals molt
capritxosos.
?s viscut com un malestar i pot estar associat
a un sentiment de culpa o de vergonya.
4. CAUSES
o El mecanisme principal que ho causa és desconegut.
o Factors ambientals i genètics contribueixen a la seva
aparició.
o Anormalitats en el lòbul frontal i els ganglis basals
o Anormalitats en certs neurotransmissors ( els
“missatgers del cervell”) –Exemple: serotonina, ajuda a
regularitzar l’estat d’ànim, l'agressivitat i els impulsos..
5. S?MPTOMES
-Obsessius:
? Por a contaminar-se
? Por a causar d’anys a persones pròximes ( família,
amics,…)
? Idees agressives o contingut sexual
? Escrupolositat/ religiositat excessiva. Pensaments
prohibits.
? Necessitat de simetria.
? Necessitat de dir o confessar.
6. S?MPTOMES
-Compulsius
? Rentar-se
? Repetir una acció fins fer-la “bé”
? Assegurar-se de coses repetidament.
? Tocar
? Contar objectes o fins un determinat número
? Ordenar
? Acumular (no poder tirar nada)
? Resar
7. TIPUS
o Rentadores i netejadors:
Obsessions relacionades amb la
contaminació en determinats objectes o
situacions.
8. TIPUS
? Verificadors:
inspeccionen
excessivament amb el propòsit
d'evitar possibles catàstrofes.
10. TIPUS
? Ordinadors: exigeixen que les coses que
els envolten estiguin disposades d'acord
amb determinades pautes rígides,
incloent distribucions simètriques.
11. TIPUS
? Acumuladors: col·leccionen objectes
insignificants, dels quals no poden
desprendre's. (Es pot relacionar amb el
síndrome de Diògenes)
12. TIPUS
? Numerals: busquen sentit als
nombres que els envolten; sumant-
los, restant-los, canviant-los fins que
els dóna un nombre significatiu per a
ells.
13. TIPUS
? Turmentats i obsessius purs: pensaments
negatius reiterats, incontrolables i
pertorbadors. Processos reiteratius
únicament mentals.
14. TIPUS
? Sexuals: pensaments sexuals recurrents,
abasten totes les particularitats i
conductes sexuals, com: idees infundades
sobre tenir disfuncions sexuals o no ser
apetible.
15. TIPUS
? OrientacióSexual: ?s refereix
específicament a dubtes, idees fixes i
compulsions sobre l'homosexualitat.
16. TRACTAMENTS
? Farmacològics o cognitivo-conductuals.
? Teràpia amb especialistes en el trastorn.
? Nohi ha un tractament fix, sinó que
depèn de la persona i el tipus de trastorn
que pateixi.
17. ENLLA?OS D’INTER?S
? http://www.youtube.com/watch?v=zvgC2fvaRec (Coneix el
TOC – 1)
? http://www.youtube.com/watch?v=odDhIkWhnAE&feature=re
lated (Coneix el TOC – 2)
? http://www.youtube.com/watch?v=WItHqR65HOw&feature=re
lated (Coneix el TOC – 3)
? http://asociaciontoc.org/toc/test.htm (Test)